High-Volume Thermal Chuck

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AC3 Thermal Chuck

AC3 Thermal Chuck

AC3 modular patented air-only chuck system

Fully integrated hot/cold solutions for all major production and laboratory wafer probers

1. No liquids or Peltier elements

2. MTBF > 50,000 hours

3. Temperature ranges from -65 to +400 °C

4. Modular system, adaptable to individual testing requirements

5. High energy dissipation option with patented

    PowerSense® upgrade

ERS AC3 provides a full temperature range with air reliability and unmatched chiller compactness.

  • Air only – no liquids or Peltier elements

  • MTBF > 50,000 hours

  • Temperature ranges from -65 to +400 °C

  • Modular system, adaptable to individual testing requirements

  • Low-noise capability in the fA-range

  • High energy dissipation option with patented PowerSense® upgrade

  • Space-saving chiller dimensions

  • No separate purge air source required

  • Compatible with all major production probers and all major analytical probers

  • Full hardware and software integrations available

  • Service-friendly FRU (Field Replacement Units) component

Air-only cold test for 24-hour reliable operation

In use at renowned production floors and research laboratories world-wide, the patented AC3 system is famous for its wide temperature range, compact chiller, low power requirements and air-only reliability. Highest system uptimes, compact footprint in the clean room and reduced utilities costs translate to the lowest COO in the industry.

Unrivalled efficiency thanks to the patented ACP Technology

The core technology of the highly efficient AC3 is the patented ACP air management system. ACP extracts maximum effect from the chilled coolant air in a two-pass cooling operation. The expended super-dry, clean coolant air is then available as a cost-saving purge gas to prevent icing on the wafer and the surrounding area.

High performance for both laboratory and production environment

Close cooperation over the years with both the laboratory end-user and with the vendors of high-quality analytical wafer probers has produced the best performance in low-noise test. The demands of the wafer sort floor during high pin-count test are also met due to the high rigidity of the AC3 wafer chuck.


Available upper temperature limits +150°C up to +300°C, +400 °C option available
Available lower temperature limits +35, +20, -40, -55 °C
Coolant Air (user supplied)
Chuck Temperature Display Resolution 0.01°C 
Smallest Temperature Selection Step 0.1°C 
Temperature accuracy ±0.1 °C
Max. voltage between chuck top and GND  500 V DC (high voltage option up to 10 kV available)
Surface flatness and base parallelism -55 °C up to +300 °C < ±12µm (tighter range on request)
Temperature uniformity - 55 °C to +200 °C < ±0.5 °C 
> 200 °C < ±0.5 %
Electrical Isolation STD > 2,5 T Ohm at +25 °C
Temperature sensor Pt100 1/3DIN, 4-line wired
Chuck surface plating Nickel (gold or non-conductive available)
Interfaces RS232C, Ethernet, others on request
Control method Low noise DC/PID with Temperature Dynamic Control TDC
Heating rates for 300 mm system - 55 °C to +25°C:  10 min 
- 40 °C to +25°C:  8 min 
+25 °C to +150 °C: 15 min 
+25 °C to +200 °C:  20 min 
+25 °C to +300 °C:  30 min
Cooling Rates for 300 mm system +150 °C to +25 °C: 25 min 
+200 °C to +25 °C: 30 min 
+300 °C to +25 °C: 35 min
+25 °C to - 20 °C: 15 min
+25 °C to -40 °C: 25 min
+25 °C to -55 °C: 30 min


ERS electronic GmbH  總公司設立於德國,致力於提供半導體產業創新的晶圓溫度測試解決方案逾 50 年;ERS 開發及生產之熱卡盤系統系列產品:AC3、AirCool © 、AirCool ©  Plus 及 PowerSense © 銷售全球,是大尺寸晶圓針測機中不可或缺的產品。ERS 還開發eWLB制程設備,用於去載板和去載板後的產品去翹曲。超過10年的服務該領域,不斷完善設備和工藝。ERS可以為客戶提供優良的FOWLP和FOPLP的優良的工藝設備,以及保證工藝完成的De-warpage設備。