Reflow System

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SRS300 Fluxless Reflow System

SRS300 Fluxless Reflow System

SRS300 Fluxless Reflow System

Applications

  • Fluxless/Flux(Lead free) reflow for solder bump ball, CU pillar & micro bump
  • Vacuum reflow system(Model : SRS30V))

Advantage

  • Void-free bump ball connection
  • Void-free bump ball performance
  • Vacuum reflow system by dry pump(~3mTorr)
  • Various temp. profile(Step & Slope type)
  • Outstanding O2 density control(〈1ppm) at every process : to improve process quality

Foot Print

  • Foot print : 2,350*2,520*2,800(W*H*D)
  • Temp. control : 250℃±1%(Max. 450℃)
    Real time monitoring of process wafer temp.
  • Process gas : Formic acid or no reactant gas
  • Process pressure : Low pressure(Model : SRS30V)
    Normal pressure(Model : SRS300).
  • EFEM(2 or 3 port) : SEMI Standards.

STI 是總部位於韓國的面板及半導體設備製造公司,其產品包含中央化學供酸系統、濕製程設備、OLED噴墨打印機、Foup清洗機和應用於半導體晶圓級封裝(Wafer Level Package)製程的真空迴焊設備, 濕式噴砂機, 以及面板級封裝(Panel Level Package)製程用濕製程設備等產品。STi成立20年來, 產品深獲客戶信賴, 客戶遍及台灣、中國、 韓國、日本,東南亞以及其它歐美系客戶。