Micro Electro Mechanical Systems (MEMS) Testing

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【AFORE】Probe System

【AFORE】Probe System

Wafer and wafer-frame probe stations of AFORE are optimized for test and calibration of a variety of MEMS and other semiconductor devices. The main benefits of AFORE application specific test solutions are:

  • Early device characterization at wafer level → Faster time to market
  • Improved quality control during wafer manufacturing → Better yield and product quality
  • Known Good Die and quality binning during wafer sort → Cost savings
  • Final test of wafer level packaged devices → Improved yield by eliminating pick and place operations

 

【KRONOS - Inertial Sensor Wafer Probe System

AFORE’s specialized probe station for precise test and calibration of gyroscopes and accelerometers.

The probe stations’ sturdy structure enables probing, testing, and stepping in any orientation or during rotation with high positioning accuracy. It uses unique mechanics placed in a dual-axis turning unit with infinite rotation.

The KRONOS handles wafer sizes up to 200mm with high multisite testing capability and optional temperature chuck systems. The system allows fast automatic wafer or frame loading from cassette to prober and back.

 

【AIOLOS - Pressure Sensor Test System】

AIOLOS platform offers automated probing from development lab to high volume production. It caters for up to 200mm wafers and wafer-frames. The system allows both robotic and manual loading.

The standard configuration supports pressure levels from standard vacuum to 2.000hPa(abs) at Pa level resolution. Optional high vacuum and high-pressure versions are also available.

It offers a range of temperature options that allow testing at automotive grade temperature levels.

For probing of diced wafers on wafer-frames the AIOLOS comes with our innovative active alignment feature to maximize the number of devices under test in one touch-down.

 

【MPP - Multi Purpose Frame/Wafer Probe System

The versatile AFORE MPP platform offers automated probing from development lab to high volume production. It caters for up to 200mm wafers and wafer-frames. The system allows both robotic and manual loading.

For probing of diced wafers on wafer-frames the AFORE MPP comes with our innovative active alignment feature to maximize the number of devices under test in one touch-down.

The AFORE MPP platform offers a range of temperature options that allows testing at automotive grade temperature levels.

 

 

 AFORE Oy

AFORE is a pioneer in MEMS test equipment industry and offers a range of advanced test solutions for MEMS devices, including the world's only commercial Wafer-Level Chip Scale Packaging (WLCSP) MEMS test solution for motion sensors. Afore's solutions are used in MEMS development ad manufacturing in the automotive, industrial, and consumer sectors in Europe, USA and Japan. Afore was founded in 1995 and serves its global customers from its headquarters in Lieto, Finland.