Jul/2026
2026 Advanced Packaging Technology Forum
Hosted by Spirox, with featured speakers from Corning and DNP (Dai Nippon Printing), this forum will explore the latest developments in Glass Core materials, high-speed data transmission and reliability challenges, failure mechanisms in large AI server packages, as well as critical inspection and analytical technologies. Join us to gain insights into the trends and opportunities shaping the future of advanced packaging.
Date: September 8, 2026
Time: 14:00-17:00
Venue: Banquet Hall I, 3F, East Building, Sheraton Hsinchu Hotel
ADVANCED PACKAGING TECHNOLOGY FORUM
Glass Core and TGV for Next-Generation AI and HPC
As AI and HPC applications continue to grow rapidly, Glass Core and Through-Glass Via (TGV) technologies are emerging as key enablers of next-generation advanced packaging. However, mastering glass materials, effectively controlling TGV manufacturing processes and reliability, and enhancing inspection capabilities remain among the most critical challenges on the path to high-volume production.
Hosted by Spirox, with featured speakers from Corning and DNP (Dai Nippon Printing), this forum will explore the latest developments in Glass Core materials, high-speed data transmission and reliability challenges, failure mechanisms in large AI server packages, as well as critical inspection and analytical technologies. Join us to gain insights into the trends and opportunities shaping the future of advanced packaging.
AGENDA
| Time | Agenda | Speaker |
|---|---|---|
| 13:30-14:00 | Registration | |
| 14:00-14:10 | Welcome Remarks |
Peter Chin Chairman, Spirox |
| 14:10-14:20 | SpiroxLTS®: From Technology Innovation to Industry Collaboration for Glass Core and TGV Development |
Paul Yang CEO, Spirox |
| 14:20-15:00 | Glass Core to enable AI and HPC Advanced Packaging |
Odessa Petzold Program Director, Corning |
| 15:00-15:20 | Tea Break | |
| 15:20-16:00 | Failure Mechanism Analysis and Reliability Improvement of Glass Core Substrates for Large AI Data Server Packages |
Satoru Kuramochi Research Fellow, DNP |
| 16:00-16:30 | Inspection of Critical Features in Glass Core and TGV: From Defect Analysis to Process Validation |
Jet Li Director, Spirox |
| 16:30-16:50 | Closing |
|
**The organizer reserves the right to amend the agenda, speakers, and event program without prior notice.**
SPEAKERS
Odessa Petzold
Program Director
Corning Incorporated
Satoru Kuramochi
Research Fellow
Dai Nippon Printing Co., Ltd.
Jet Li
Director
Spirox Corporation
VENUE
Banquet Hall I, 3F, East Building, Sheraton Hsinchu Hotel
No.265, Dong Sec. 1, Guangming 6th Rd., Zhubei City, Hsinchu County 302
TERMS & CONDITIONS
- The registration deadline is August 23, 2026. The organizer reserves the right to adjust the deadline based on registration status.
- This event requires online registration in advance. Please do not use false or misleading personal information, as this may result in legal liability. The organizer reserves the right of final approval of registration eligibility.
- All registrations are subject to review by the organizer. Priority will be given to applicants whose profiles align with the event theme.
- A confirmation email (check-in notice) will be sent to approved participants prior to the event. This email serves as proof of attendance eligibility. Participants who do not meet the selection criteria will receive a notification of non-approval.
- Please bring your check-in notice, including the registration number, to complete the on-site check-in process on the event day.
- The organizer reserves the right to amend, interpret, or update the event terms and conditions without prior notice.
- The organizer reserves the right to modify the seminar agenda and speakers in the event of unforeseen circumstances.
- In the event of a natural disaster (e.g., earthquakes or typhoons), the event may be postponed, and further arrangements will be announced separately.
- For any inquiries regarding this event, please contact the organizing team at marketing@spirox.com
