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EVENTS & COURSES
EVENTS & COURSES
Registration Open
Jul/2026
2026 Advanced Packaging Technology Forum
Hosted by Spirox, with featured speakers from Corning and DNP (Dai Nippon Printing), this forum will explore the latest developments in Glass Core materials, high-speed data transmission and reliability challenges, failure mechanisms in large AI server packages, as well as critical inspection and analytical technologies. Join us to gain insights into the trends and opportunities shaping the future of advanced packaging.
Date: September 8, 2026
Time: 14:00-17:00
Venue: Banquet Hall I, 3F, East Building, Sheraton Hsinchu Hotel