08/Dec/2025

Spirox Enhances SpiroxLTS® to Meet Rising HBM Memory Demand
Non-Destructive TSV Inspection Breakthrough Provides CriticalQuality Insights and Secures Confirmed Orders

Home page News Latest News Spirox Enhances SpiroxLTS® to Meet Rising HBM Memory Demand Non-Destructive TSV Inspection Breakthrough Provides CriticalQuality Insights and Secures Confirmed Orders

Spirox (TWSE: 3055), a leading semiconductor equipment provider, announced another breakthrough with its industry-first patented Spirox Laser Tomography Scan (SpiroxLTS^®) technology. Spirox has introduced a dual-optical-path module for its SP8000S non-destructive TSV inspection system, enabling high precision measurement of individual TSV depth, sidewall defects, and bottomresidues. This advancement helps customers overcome long-standing process bottlenecks by these measurements. Spirox confirmed that the SP8000S system has passed customer qualification and received a confirmed purchase order, with shipments scheduled for next year and expected to contribute directly to revenue and profitability.

The Spirox SP8000S inspection system has successfully passed customer validation and secured official orders, while the newly launched dual optical-path module enables precise inspection of TSV via depth, sidewall defects, and bottom residues.

Through-Silicon Via (TSV) technology, known for its high-density and low-latency vertical interconnect capability, has become fundamental to 3D ICs, stacked memory such as HBM and WoW, high-performance computing (HPC), and AI chips. As memory demand continues to grow, TSV diameters are shrinking from the mainstream 5 µm toward smaller sizes such as 3 µm. This shift makes non-destructive inspection of individual TSV depth, sidewall defects, and bottomresidues increasingly challenging and has become a key barrier to further yield improvement.

TSV depth information is critical as it directly affects several key steps, including etching, via filling, electrical reliability, and backend assembly. Today, most of the industry relies on OCT optical interferometry for measurement—an approach that requires nearly two months of preliminary parameter setup and can only provide average depth data across multiple vias, making it impossible to measure individual TSVs. Equipped with a dual-optical-path module powered by SpiroxLTS^®, the SP8000S completes depth measurements across nine regions of a 12-inch wafer in just over ten minutes and provides depth data for each individual TSV measured, greatly benefiting customers. In addition, the SP8000S performs real-time, non-destructive inspection of bottom residues and sidewall defects to ensure stable quality and improve overall yield.

“We are pleased that SpiroxLTS^® is enabling customers to overcome challenges in advanced TSV processing and allowing them to quickly assess TSV quality during both R&D and manufacturing,” said Paul Yang, CEO of Spirox. “The unique non-destructive inspection capability of SpiroxLTS^® makes it an ideal solution for advanced process requirements, empowering customers to monitor quality in real time and reduce costs throughout various stages of production. With SP8000S successfully qualified by fab customers and firm orders secured, we are confident that SP8000S will be adopted by more customers and deliver substantial value to Spirox.”

About Spirox

Spirox Corporation (TWSE: 3055) is a leading brand in testing, packaging, inspection, and verification across the Greater China. Spirox provides high-quality and highly reliable equipment and services to the semiconductor and electronics manufacturing industries. Its portfolio includes proprietary equipment and distributed brands covering packaging, optical, laser, and materials inspection technologies, delivering advanced capabilities and high value-added services. Founded in 1987 and headquartered in Hsinchu, Spirox also operates service locations in Shanghai, Suzhou, and Shenzhen. For more information, please visit www.spirox.com。

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