Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection
Advanced Packaging Technology Forum Brings Together Corning and DNP to Highlight Key Technologies for TGV Advanced Packaging

As AI, high-performance computing (HPC), and high-bandwidth memory (HBM) continue to accelerate the development of advanced packaging technologies, Glass Core and TGV are emerging as key technologies for next-generation advanced packaging. The forum brought together industry professionals from the semiconductor, packaging, and related sectors to explore the complete technology chain spanning materials, processes, reliability, and inspection.

Odessa Petzold, Program Director, Glass Core at Corning Research and Development Corporation, said, “We are pleased to participate in Spirox’s forum and exchange insights with industry partners on the latest developments and challenges in Glass Core. Spirox’s laser tomography scanning technology represents an innovative approach to non-destructive inspection of glass materials. Its unique optical inspection capabilities can detect defects within glass structures without damaging the material, making it a valuable tool for advanced packaging processes such as TGV. It can help improve processes and accelerate the transition to high-volume manufacturing.”

Satoru Kuramochi, Research Fellow at DNP, noted, “As AI servers continue to drive demand for high-performance, high-density packaging, reliability and failure analysis will become increasingly important as Glass Core technologies move toward high-volume manufacturing. We are pleased to participate in this forum and share our work on improving the reliability of Glass Core substrates for large AI data server packages. Non-destructive inspection technologies for TGV and glass substrates are expected to play an important role in identifying defects and understanding issues that may occur at different stages of the manufacturing process. We believe that continued advances in inspection and analysis technologies will contribute to improving the reliability of Glass Core substrates and to the development of a more comprehensive Glass Core technology ecosystem.”

Spirox also announced the launch of the SP7000G High-Speed TGV Crack Inspection System, which can complete a full-panel scan of a 510 mm × 515 mm glass substrate in less than 20 minutes, making it well suited for detecting internal microcracks in glass substrates after metallization and ABF build-up processes. By enabling high-speed inspection, the SP7000G helps customers improve inspection efficiency, monitor process quality and defect distribution, and further optimize processes and improve yield.

About Spirox

Spirox Corporation (TWSE: 3055) is a leading provider of testing, packaging, inspection, and verification solutions in Greater China. Spirox provides high-quality, highly reliable equipment and services to the semiconductor and electronics manufacturing industries, with a portfolio of proprietary and distribution products spanning a broad range of applications, including semiconductor packaging and testing, optics, laser, and materials inspection. Spirox is committed to delivering advanced technologies and high-value-added services to customers. Founded in 1987 and headquartered in Hsinchu, Taiwan, Spirox has operations and service locations in Shanghai, Suzhou, and Shenzhen. For more information, please visit www.spirox.com。

About Corning

Corning（www.corning.com） is one of the world’s leading innovators in materials science, with a 175-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics, along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people’s lives. Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries. Corning’s capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping its customers capture new opportunities in dynamic industries. Today, Corning’s markets include optical communications, mobile consumer electronics, display, automotive, solar, semiconductors, and life sciences.

About DNP

Founded in 1876 and headquartered in Tokyo, Japan, Dai Nippon Printing Co., Ltd. (DNP) (www.global.dnp) is a leading global printing and technology company. Leveraging its proprietary Printing and Information (P&I) technologies, DNP operates across a wide range of fields, including publishing, packaging, industrial films, electronic components such as display materials, and lifestyle products. DNP continues to create new value through technological innovation and is committed to contributing to a sustainable future for people and society.