Spirox (TWSE: 3055), a leading semiconductor equipment provider, announced another breakthrough with its industry-first patented Spirox Laser Tomography Scan (SpiroxLTS®) technology. Spirox has introduced a dual-optical-path module for its SP8000S non-destructive TSV inspection system, enabling high precision measurement of individual TSV depth, sidewall defects, and bottomresidues. This advancement helps customers overcome long-standing process bottlenecks by these measurements. Spirox confirmed that the SP8000S system has passed customer qualification and received a confirmed purchase order, with shipments scheduled for next year and expected to contribute directly to revenue and profitability.