Professional semiconductor equipment provider Spirox Corporation (TWSE: 3055) has introduced the industry-first SpiroxLTS (Spirox Laser Tomography Scanning) technology. Leveraging a combination of multiple patented nonlinear optical integration technologies, this innovative solution enables non-destructive, contact-free, damage-free direct imaging of laser-modified cross-sections within through glass vias (TGV). SpiroxLTS delivers precise insights into laser modification effectiveness, fully visualizing the continuity and uniformity of modifications within the glass, ensuring that process quality meets stringent design requirements. This breakthrough brings a revolutionary advancement in process parameter control for TGV fabrication and will help TGV manufacturers accelerate their mass production timelines.