Financial News

Spirox Corporation (TWSE: 3055), a leading semiconductor equipment provider, today hosted the Advanced Packaging Technology Forum – Development and Challenges of Glass Core and TGV for Next-Generation AI and HPC, bringing together experts from Corning and Dai Nippon Printing (DNP) to share the latest developments in Glass Core materials, TGV processes, packaging reliability, and inspection technologies. At the forum, Spirox also unveiled its new SP7000G High-Speed TGV Crack Inspection System, demonstrating its capabilities in advancing inspection solutions for the high-volume manufacturing of Glass Core and TGV.