Non-Destructive TGV Laser Modification Inspection System

Industry-first Non-Destructive Laser Modification Inspection System with SpiroxLTS Technology!

Tomogram of Laser Modification for Superior Pre-Etching Quality Assessment & Precision Control for Success!
PRODUCT DESCRIPTION

PRODUCT DESCRIPTION

  • Exclusive Patented SpiroxLTS Technology

    Advanced non-linear optical measurement with SpiroxLTS Technology for the improvement of the laser modification to best match the glass processing.
  • No Destruction on Sample

    Non-destructive inspection with SpiroxLTS enables precise control of laser modification performance, significantly reducing process costs and optimizing production conditions!

TGV Manufacturing Process Optimization: Key Role in Process Parameter Optimization

Laser Modification

Laser Modification Impact on Post-Etching TGV

3D Tomogram : Continuity and Uniformity of Laser Modification

Dynamic Tomogram of Laser Modification

It’s able to observe Laser modification variations along the vertical depth changes.

  

Tracking Function of Dynamic Tomogram of Laser Modification

: Inspection Area  : Observation Center : Criteria Mask


TGV Etching

TGV Dimension Measurement

Roughness Calculation after Via Etching

It’s able to observe the difference of A & B by 3D profile image; Adopt Z axis resolution with precise level and inspection of micro area, the roughness could be calculated.

Metallization

Crack inspection after TGV Metallization & CMP

CPO & MORE APPLICATIONS

CPO & MORE APPLICATIONS

Co-Packaged Optics (CPO) Applications

Cavity in CPO Applications

Glass Optical Waveguide in CPO Applications

It’s able to inspect the waveguide structure made by laser modification in the glass, and observe its profile with 3D image!

Dicing Lane Inspection

Laser Modification: Dicing Lane

After Etching: Dicing Lane Inspection

FEATURES

FEATURES

Patented SpiroxLTS technology, precisely analyzing laser modification effectiveness.
Non-destructive measurement. Comprehensive inspection of laser modification continuity and uniformity, ensuring that laser modification quality meets process design requirements.
TGV profile inspections: TCD, Waist CD, BCD, depth, roundness.
Crack inspection after TGV metallization & CMP : Accurately inspect the length and depth of crack-affected areas, and observe the crack conditions through 3D imaging.
ADVANTAGES

ADVANTAGES

Industry-First Direct Identification
The only technology for inspecting laser modification continuity and uniformity, providing early prediction of etched perforation outcomes after laser modification.
Process Parameter Optimization and Calibration
Tomogram of laser modification enables rapid adjustment of laser parameters and optimization of optical path design, significantly saving process development time.
TGV Profile Inspection
Offering a more efficient, direct, and concrete inspection method without destruction.
Precise Measurement of Sample Size and Inspection of Structural Defects
Identify the waist position, critical dimensions, roundness, and the impact area, length, and depth of cracks after metallization.
FUNCTION DESCRIPTION

FUNCTION DESCRIPTION

Process Development
Significantly shortens development time and effectively reduces R&D costs. Precisely select laser source and glass material to ensure that TGV laser modification and through-via etching meet manufacturing quality specifications.
Process Monitoring
Monitor laser modification quality before etching, providing real-time prediction on whether etching is necessary, avoiding blind etching from past practices and preventing unnecessary cost waste.
TGV Yield Improvement
Monitor TGV quality, reduce product defects, increase output, and prevent the batch costs associated with ineffective yield.
PRODUCT SPECIFICATIONS

PRODUCT SPECIFICATIONS

Item Content
Model Number SP8000G
Model Name Non-Destructive Laser Modification Inspection System
Key Optical Technology Patented SpiroxLTS Non-linear Optical Inspection (Application wavelength 1200 - 1800 nm)
Applicable Substrate Size

Standard: 310 mm x 310 mm

Maximum: 510 mm x 515 mm

Measurement Items

Tomogram of Laser Modification, 3D Tomogram of Laser Modification, Dynamic Tomogram of Laser Modification; TGV Aperture Size and Roundness Measurement, TGV Waist Depth Positioning, TGV 3D Profile Image, TGV Cross Section Analysis; Crack Inspection after TGV Metallization & CMP

FOV / Measurement Time

FOV 400 µm x 400 µm @ 20x objective magnification;

3.5 seconds / frame (Scanning resolution: 512 x 512 pixels);100 frames ≒ 6 minutes

Inspection Modes Micro-area imaging, sub-region automatic measurement, coordinate-based automatic measurement, random automatic measurement, script scanning process.
Measurement Resolution

Image Minimum Resolution 0.5 µm

Movement Accuracy X-Y axis Precision 0.1 µm, Z axis Precision 0.02 µm
Load & Unload

Standard: Manual (Reserve space for EFEM upgrade)

Maximum: Manual

Equipment Dimension / Weight

Standard: Length 2.375 m x Width 1.780 m x Height 1.900 m Weight 2700 kg (Tentative)

Maximum: Length 2.600 m x Width 1.600 m x Height 1.900 m Weight 3500 kg (Tentative)

Electrical Specification

220 V 60 Hz AC 4400 W (Tentative)

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