Registration Now Open | Spirox Advanced Packaging Technology Forum: Glass Core and TGV for Next-Generation AI and HPC

Driven by the rapid growth of AI, high-performance computing (HPC), and high-bandwidth memory (HBM), next-generation advanced packaging is evolving toward new architectures such as CoPoS and CPO. This transformation is accelerating innovation across materials, manufacturing processes, inspection, and reliability technologies, making Glass Core and Through-Glass Via (TGV) key enablers of future advanced packaging. To achieve high-volume manufacturing, the industry must overcome several critical challenges, including glass material optimization, effective process control and reliability of TGV structures, and enhanced inspection capabilities.

To address these opportunities and challenges, Spirox will host the Advanced Packaging Technology Forum: Glass Core and TGV for Next-Generation AI and HPC on September 8, 2026, at the Sheraton Hsinchu Hotel. The forum will feature distinguished speakers from Corning and Dai Nippon Printing (DNP), who will share the latest developments in Glass Core materials, the challenges of high-speed signal transmission and package reliability, failure mechanisms in large-scale AI server packages, and the latest inspection and analytical technologies. The forum aims to provide valuable insights into emerging technology trends and business opportunities in next-generation advanced packaging.

We sincerely invite you to join us. Spaces are limited, so please register early.