In response to a report published in Wealth Magazine on June 18, 2026, which stated that Spirox Corporation had “engaged with Samsung, initially receiving demand for HBM TSV-related services and later even selling a machine,” the Company hereby issues the following clarification:
Spirox has successfully completed customer qualification for its SP8000S non-destructive TSV inspection system and shipped the system during the current quarter. However, the actual shipment was made to a wafer fabrication customer in Taiwan and not to Samsung as stated in the media report. The information contained in the report is inconsistent with the facts and resulted from a media reporting error.
Spirox consistently complies with all applicable public disclosure requirements and strictly honors its confidentiality obligations with customers. Accordingly, the Company does not disclose customer identities. Information regarding the Company's operations and order status should be based solely on disclosures published through the Market Observation Post System (MOPS).
Investors are advised to exercise prudent judgment and refer to the Company's official disclosures for accurate information.
This statement is hereby issued for clarification.
Spirox Corporation
June 18, 2026