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Latest News
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08
Sep
YEAR
2026
Latest News
Spirox Corporation (TWSE: 3055), a leading semiconductor equipment provider, today hosted the Advanced Packaging Technology Forum – Development and Challenges of Glass Core and TGV for Next-Generation AI and HPC, bringing together experts from Corning and Dai Nippon Printing (DNP) to share the latest developments in Glass Core materials, TGV processes, packaging reliability, and inspection technologies. At the forum, Spirox also unveiled its new SP7000G High-Speed TGV Crack Inspection System, demonstrating its capabilities in advancing inspection solutions for the high-volume manufacturing of Glass Core and TGV.
22
/Apr/2024
Latest News
Spirox Product Upgrades Propel the New Wave of Compound Semiconductor Industry
Spirox (TWSE: 3055) will showcase at the Electronic Equipment Exhibition (booth No. N214) from April 24th to April 26th, featuring optical inspection systems from Southport Corporation as well as value-added IC testing equipment and maintenance services.