Spirox will host the Advanced Packaging Technology Forum: Glass Core and TGV for Next-Generation AI and HPC on September 8, 2026, at the Sheraton Hsinchu Hotel. The forum will feature distinguished speakers from Corning and Dai Nippon Printing (DNP), who will share the latest developments in Glass Core materials, the challenges of high-speed signal transmission and package reliability, failure mechanisms in large-scale AI server packages, and the latest inspection and analytical technologies.